Leqephe la Insulating la SMC
Tataiso ea Sehlahisoa
Motsoako oa ho bopa maqephe ke mofuta oa polyester e matlafalitsoeng e nang le likhoele tsa khalase.Likhoele, tseo ka tloaelo li leng 1” kapa ho feta ka bolelele, li fanyehiloe ka bateng ea resin - hangata epoxy, vinyl ester, kapa polyester.
Kopo
E sebelisoa haholo ka har'a khabinete ea taolo ea matla a motlakase, lebokose la kabo.switchboard le likarolo tse ling tsa motlakase.E na le ts'ebetso e ntle ea motlakase, ts'ebetso e ntle ea ho hanyetsa lelakabe, matla a matle a mochini, bokaholimo bo boreleli bo botle, botsitso bo boholo bo boholo.
Litšoantšo tsa lihlahisoa
Letsatsi le ka Sehloohong la Tekheniki
| Thepa | Yuniti | Mokhoa | Boleng bo tloaelehileng | Boleng bo tloaelehileng |
| Botenya | g/cm3 | ISO62(Mokhoa oa 1) | _ | 1.85 |
| Ho monya metsi 2.0mm ka botenya | % | ISO62(Mokhoa oa 1) | _ | ≤0.30 |
| Flexural matla perpendicular ho laminations - tlas'a mocheso o tloaelehileng oa kamore | MPa | ISO178:2001 | _ | ≥130 |
| Flexural matla perpendicular ho laminations - ka tlase ho 130 ℃ | MPa | ISO178:2001 | _ | ≥90 |
| Matla a tšepe | MPa | ISO527 | _ | ≥50 |
| Matla a Compressive tlasa 130 ℃ | MPa | ISO604:2002 | _ | ≥150 |
| Thempereichara ea ho kheloha tlas'a mojaro Tf=1.8MPa | ℃ | ISO75-2:2003 | _ | ≥220 |
| Lenane la mocheso (TI) Mocheso oa nako e telele oa ho hanyetsa mocheso | ℃ | IEC60216 | _ | 155 |
| Khanyetso ea Insulation | Ω | IEC60167:1964 | _ | ≥1.0x1012 |
| Insulation resistance ka mor'a ho qoelisoa metsing ka lihora tse 24 | Ω | IEC60167:1964 | _ | ≥1.0x1010 |
| Matla a dielectric mohato ka mohato ka oli ho 23 ℃, Botenya 1-3mm | kV/mm | IEC60243 | _ | ≥12.0 |
| Tumello e Lekanyelitsoeng(50Hz) | _ | IEC60250 | _ | ≤4.5 |
| Dielectric dissipation factor (50Hz) | _ | IEC60250 | _ | ≤0.015 |
| Arc Resistance | S | IEC61621 | _ | ≥180 |
| Tracking Resistance(CTI) | V | IEC60112 | _ | ≥600 |
| Ho chesa | Sehlopha | UL94 | _ | V-0 |
LBH
Q1: Na u khoebo ea k'hamphani kapa moetsi?
Re baetsi ba ka sehloohong ba motsoako oa motlakase oa motlakase, re 'nile ra kopanela ho moetsi oa thermoset rigid composite ho tloha 2003.Boemo ba rona ke 6000TONS / selemo.
Q2: Mehlala
Mehlala ke mahala, o hloka feela ho lefella tefiso ea ho tsamaisa thepa.
Q3: U tiisa joang boleng ba tlhahiso ea bongata?
Bakeng sa ponahalo, boholo le botenya: re tla etsa tlhahlobo e felletseng pele re paka.
Bakeng sa boleng ba ts'ebetso: Re sebelisa foromo e tsitsitseng, 'me e tla ba tlhahlobo ea kamehla ea lisampole, re ka fana ka tlaleho ea tlhahlobo ea sehlahisoa pele re romelloa.
Q4: Nako ea ho fana
E itšetlehile ka palo ea taelo.Ka kakaretso, nako ea ho fana e tla ba matsatsi a 15-20.
Q5: Sephutheloana
Re tla sebelisa pampiri e entsoeng ka matsoho ho paka holim'a plywood pallet.haeba u na le litlhoko tse khethehileng tsa sephutheloana, re tla paka joalo ka tlhoko ea hau.
Q6: Tefo
TT, 30% T/T esale pele ,ho leka-lekana pele ho romelloa.Re boetse re amohela L/C.
