Halogen Free FR4 Epoxy Fiberglass Laminated Sheet(EPGC310)
Tataiso ea Sehlahisoa
Halogen mahala FR4 e tšoana le FR4, empa e na le komporo ea mahala ea halogen.Sehlahisoa sena se ne se le laminated ke mocheso o phahameng le khatello e phahameng ka lesela la elektroniki la glassfiber le kenngoeng ka Halogen mahala epoxy resin.E nang le thepa e phahameng ea mochine, thepa ea dielectric le thepa e thibelang malakabe, hape e na le ho hanyetsa mocheso o motle le ho hanyetsa mongobo;
Ho lumellana le litekanyetso
TS EN 60893-3-2-2009 IEC 60893-3-2-2009 lisebelisoa tsa insulating tsa motlakase oa thermoset resin - Karolo ea 4: Li-laminate tse thata tsa epoxy resin - Karolo ea 3-2 ea lisebelisoa tsa motho ka mong Setšoantšo sa EPGC310.
Kopo
Sehlahisoa sena se sebelisoa haholo-holo e lehalogen mahala e hlokehanglikarolo tsa sebopeho bakeng sa Motor le lisebelisoa tsa motlakase, ho kenyeletsoa mefuta eohle ea switjha, lisebelisoa tsa motlakase, poleiti ea matlafatso ea FPC, liboto tsa potoloho tsa k'habone, letlapa la ho phunya komporo, hlobo le lisebelisoa tsa ho qhibilihisa (lelakabe la tlhahlobo la PCB); hape e loketse tlasa tikoloho e metsi le oli ea transfoma. .
Litšoantšo tsa lihlahisoa
Letsatsi le ka Sehloohong la Tekheniki(Tobetsa mona ho khoasolla tlaleho ea tlhahlobo ea motho oa boraro)
| Thepa | Yuniti | Boleng bo tloaelehileng | Boleng bo Tlwaelehileng | Mokhoa oa teko |
| Flexural matla perpendicular to laminations(MD) | MPa | ≥340 | 480 | IEC60893-2: 2003 |
| Matla a matla a Charpy a tšoana le laminations(Notched,MD) | kJ/m2 | ≥33 | 49 | |
| Matla a tsitsipano (MD) | MPa | ≥300 | 322 | |
| Matla a motlakase a ipapisitse le laminations (ho 90 ℃ ± 2 ℃ ho 25 # oli ea transformer, tlhahlobo ea mohato ka mohato, Φ25mm/Φ75mm cylindrical electrode) | kV/mm | ≥14.2 | 18.2 | |
| Ho senyeha ha motlakase ho tsamaisana le laminations (ho 90 ℃ ± 2 ℃ ho 25 # oli ea transformer, tlhahlobo ea mohato ka mohato ea 20s, Φ130mm/Φ130mm poleiti ea motlakase) | kV | ≥35 | >50 | |
| Tumello e Lekanyelitsoeng(1MHz) | _ | ≤5.5 | 5.20 | |
| Insulation resistance (Taper pin electrode, le sebaka sa li-electrode ke 25.0mm) | Ω | ≥5.0 x1012 | 5.9x1013 | |
| Insulation resistance(Kamora ho qoelisoa ka metsing lihora tse 24, u sebelisa li-electrode tsa "taper pin", 'me sebaka sa li-electrode ke 25.0mm | Ω | ≥5.0 x1010 | 1.3x1012 | |
| Comparative Tracking index(CTI) | _ | _ | CTI600 | |
| Botenya | g/cm3 | 1.9-2.1 | 2.0 | ISO1183-1: 2019 |
| Ho chesa (Mokhoa o otlolohileng) | Sehlopha | V-0 | V-0 | ANSI/UL-94-1985 |
| Index ea mocheso | ℃ | _ | 130 ℃ |
LBH
Q1: Na u khoebo ea k'hamphani kapa moetsi?
Re baetsi ba ka sehloohong ba motsoako oa motlakase oa motlakase, re 'nile ra kopanela ho moetsi oa thermoset rigid composite ho tloha 2003.Boemo ba rona ke 6000TONS / selemo.
Q2: Mehlala
Mehlala ke mahala, o hloka feela ho lefella tefiso ea ho tsamaisa thepa.
Q3: U tiisa joang boleng ba tlhahiso ea bongata?
Bakeng sa ponahalo, boholo le botenya: re tla etsa tlhahlobo e felletseng pele re paka.
Bakeng sa boleng ba ts'ebetso: Re sebelisa foromo e tsitsitseng, 'me e tla ba tlhahlobo ea kamehla ea lisampole, re ka fana ka tlaleho ea tlhahlobo ea sehlahisoa pele re romelloa.
Q4: Nako ea ho fana
E itšetlehile ka palo ea taelo.Ka kakaretso, nako ea ho fana e tla ba matsatsi a 15-20.
Q5: Sephutheloana
Re tla sebelisa pampiri e entsoeng ka matsoho ho paka holim'a plywood pallet.haeba u na le litlhoko tse khethehileng tsa sephutheloana, re tla paka joalo ka tlhoko ea hau.
Q6: Tefo
TT, 30% T/T esale pele ,ho leka-lekana pele ho romelloa.Re boetse re amohela L/C.