EPGC201 Epoxy Fiberglass Laminated Sheet(G10)
Tataiso ea Sehlahisoa
Lisebelisoa tsa EPGC201 ke li-laminates tse matlafalitsoeng tsa fiberglass tse 7628, tse kopantsoeng le epoxy resin. Ka thepa e phahameng ea mochini le dielectric, mocheso o motle le ho hanyetsa maqhubu, hape ka machinability e ntle; Sehlahisoa sena se ka kopana le maemo a EU ROHS, se romelloa ka bongata ho Aisa boroa-bochabela, Europe, India, joalo-joalo.
EPGC201 e bapa le NEMA G-10.
Ho lumellana le litekanyetso
TS EN 60893-3-2-2009 IEC 60893-3-2-2009 lisebelisoa tsa insulating tsa motlakase oa thermoset resin - Karolo ea 4: Li-laminate tse thata tsa epoxy resin - Karolo ea 3-2 ea lisebelisoa tsa motho ka mong lintlha tse qaqileng EPGC201.
Kopo
E loketse bakeng sa ts'ebeliso ea litlhoko tse phahameng tsa lisebelisoa tsa elektronike tsa lihlahisoa, tse kang FPC reinforcement plate, PCB drilling pad, fiberglass meson, glass fiber board potentiometer carbon film printing, precision tour stars gear grinding (chip), poleiti ea tlhahlobo e nepahetseng, motlakase (motlakase) Lisebelisoa tsa ho kenya li-clapboard, plate ea insulating, boto ea ho kenya li-transformer, likarolo tsa motlakase, lebili la ho sila, boto ea elektroniki, joalo-joalo.
Litšoantšo tsa lihlahisoa
Letsatsi le ka Sehloohong la Tekheniki(Tobetsa mona ho khoasolla tlaleho ea tlhahlobo ea motho oa boraro)
| Thepa | Yuniti | Boleng bo tloaelehileng | Boleng bo tloaelehileng |
| Flexural matla perpendicular to laminations(MD) | MPa | ≥340 | 521 |
| Matla a matla a Charpy a tšoana le laminations(Notched,MD) | kJ/m2 | ≥33 | 63.8 |
| Matla a tsitsipano (MD) | MPa | ≥300 | 412 |
| Matla a motlakase a perpendicular to laminations (1mm botenya) (ho 90 ℃ ± 2 ℃ ho 25 # transformer oli, 20s mohato ka mohato teko, Φ25mm/Φ75mm cylindrical electrode) | kV/mm | ≥14.2 | 22.1 |
| Ho senyeha ha motlakase ho tsamaisana le laminations (ho 90 ℃ ± 2 ℃ ho 25 # oli ea transformer, tlhahlobo ea mohato ka mohato ea 20s, Φ130mm/Φ130mm poleiti ea motlakase) | kV | ≥35 | 88.3 |
| Tumello e Lekanyelitsoeng(1MHz) | _ | ≤5.5 | 4.90 |
| Insulation resistance (Taper pin electrode, le sebaka sa li-electrode ke 25.0mm) | Ω | ≥5.0 x1012 | 3.9x1014 |
| Insulation resistance(Kamora ho qoelisoa ka metsing lihora tse 24, u sebelisa li-electrode tsa "taper pin", 'me sebaka sa li-electrode ke 25.0mm | Ω | ≥5.0 x1010 | 2.3x1014 |
| Comparative Tracking index(CTI) | _ | _ | CTI600 |
| Botenya | g/cm3 | 1.8-2.0 | 1.97 |
LBH
Q1: Na u khoebo ea k'hamphani kapa moetsi?
Re baetsi ba ka sehloohong ba motsoako oa motlakase oa motlakase, re 'nile ra kopanela ho moetsi oa thermoset rigid composite ho tloha 2003.Boemo ba rona ke 6000TONS / selemo.
Q2: Mehlala
Mehlala ke mahala, o hloka feela ho lefella tefiso ea ho tsamaisa thepa.
Q3: U tiisa joang boleng ba tlhahiso ea bongata?
Bakeng sa ponahalo, boholo le botenya: re tla etsa tlhahlobo e felletseng pele re paka.
Bakeng sa boleng ba ts'ebetso: Re sebelisa foromo e tsitsitseng, 'me e tla ba tlhahlobo ea kamehla ea lisampole, re ka fana ka tlaleho ea tlhahlobo ea sehlahisoa pele re romelloa.
Q4: Nako ea ho fana
E itšetlehile ka palo ea taelo.Ka kakaretso, nako ea ho fana e tla ba matsatsi a 15-20.
Q5: Sephutheloana
Re tla sebelisa pampiri e entsoeng ka matsoho ho paka holim'a plywood pallet.haeba u na le litlhoko tse khethehileng tsa sephutheloana, re tla paka joalo ka tlhoko ea hau.
Q6: Tefo
TT, 30% T/T esale pele ,ho leka-lekana pele ho romelloa.Re boetse re amohela L/C.