Theko e Molemohali ea China 6mm Insulation Epoxy Resin Fiberglass Board
Mokhatlo o boloka mohopolo oa ts'ebetso "tsamaiso ea mahlale, boleng bo holimo le ts'ebetso ea boleng bo holimo, moreki ea phahameng ka ho Fetisisa bakeng sa Theko e Molemohali ea China 6mm Insulation Epoxy Resin Fiberglass Board, Lihlahisoa tsohle li tla ka boleng bo botle le lits'ebeletso tse phethahetseng ka mor'a thekiso.E shebaneng le 'maraka le bareki ke seo esale re se batla.Ke labalabela ho sebelisana le Win-Win!
Mokhatlo o boloka mohopolo oa ts'ebetso "tsamaiso ea mahlale, boleng bo holimo le boleng bo holimo, moreki ea phahamengLetlapa la China Fiber Epoxy Resin, Letlapa la Epoxy Fiber, Re u amohela ka mofuthu hore u re etele ka seqo.Re tšepa ho theha setsoalle sa nako e telele se thehiloeng tekano le melemo e kopanetsoeng.Haeba u batla ho ikopanya le rona, ka kopo u se ke oa tsilatsila ho letsetsa.Re tla ba khetho ea hau e ntle ka ho fetisisa.
Tlhaloso ea Sehlahisoa
Sehlahisoa sena ke sehlahisoa sa laminated se entsoeng ka lesela la khalase le sa sebetseng la alkali, ka ho tobetsa ka mocheso o phahameng oa Tg epoxy resin joalo ka binder. mongobo.Thermostability ke grade F, e loketse mefuta eohle ea motlakase, lisebelisoa tsa motlakase, tsa elektroniki le tse ling.
Likaroloana
1.Botsitso bo botle ba motlakase tlas'a mongobo o phahameng;
2.Matla a phahameng a mochine tlas'a mocheso o phahameng, tekanyo ea ho boloka matla a mochine≥50% tlas'a 180℃;
3.Ho hanyetsa mongobo;
4.Ho hanyetsa mocheso;
5.Ho hanyetsa mocheso: Sehlopha sa H,180℃
Index ea Ts'ebetso e ka Sehloohong
Ho ea ka GB/T 1303.4-2009 motlakase oa thermosetting resin laminates hard laminates - Karolo ea 4: epoxy resin hard laminates.
Ponahalo: bokaholimo bo lokela ho ba bo bataletseng, bo se na li-bubble, likoting le masoba, empa liphoso tse ling tse sa amang ts'ebeliso li lumelletsoe, joalo ka: mengoapo, indentation, matheba le matheba a seng makae. sefahleho sa ho qetela se ke ke sa senyeha le ho phunyeha.
Kopo
E loketse mefuta eohle ea enjene, lisebelisoa tsa motlakase, tsa elektroniki le tse ling.
Index ea Ts'ebetso e ka Sehloohong
NO. | ITEM | THUTO | INDEX BOHLOKO | |||
01 | Botenya | g/cm³ | 1.8-2.1 | |||
02 | Ho monya metsi | % | <0.5 | |||
03 | Matla a ho kobeha a otlolohileng | Tloaelehileng | Bolelele | MPa | ≥450 | |
≥380 | ||||||
Ka morao | ||||||
180±2℃ | Bolelele | ≥250 | ||||
≥190 | ||||||
Ka morao | ||||||
04 | Matla a amang (mofuta oa Charpy) | Ha ho Lekhalo | Bolelele | KJ/m² | ≥180 | |
Ka morao | ≥137 | |||||
05 | matla a ho hatella | E otlolohileng | MPa | ≥500 | ||
Bapisa | ≥250 | |||||
06 | Matla a tšepe | Lenthways | MPa | ≥320 | ||
Ka morao | ≥300 | |||||
07 | Matla a tlamahano | N | ≥7200 | |||
08 | Matla a motlakase a emeng (ka oli ea 90 ℃ ± 2 ℃ 1min) | 1mm | MV/m | ≥17.0 | ||
2mm | ||||||
≥14.9 | ||||||
3mm | ||||||
≥13.8 | ||||||
09 | Parallel breakdown voltage (ka oli ea 90 ℃ ± 2 ℃) | KV | ≥40 | |||
10 | Relative dielectric constant (50Hz) | - | ≤5.5 | |||
11 | dielectric dissipation factor (50Hz) | - | ≤0.04 | |||
12 | Tšireletso e ts'oanang ea ho hanyetsa | Tloaelehileng | MΩ | ≥5.0×106 | ||
Ka mor'a ho koloba ka lihora tse 24 | ≥5.0×104 |
Mokhatlo o boloka mohopolo oa ts'ebetso "tsamaiso ea mahlale, boleng bo holimo le ts'ebetso ea boleng bo holimo, moreki ea phahameng ka ho Fetisisa bakeng sa Theko e Molemohali ea China 6mm Insulation Epoxy Resin Fiberglass Board, Lihlahisoa tsohle li tla ka boleng bo botle le lits'ebeletso tse phethahetseng ka mor'a thekiso.E shebaneng le 'maraka le bareki ke seo esale re se batla.Ke labalabela ho sebelisana le Win-Win!
Molemo ka ho fetisisa Theko bakeng saLetlapa la China Fiber Epoxy Resin, Letlapa la Epoxy Fiber, Re u amohela ka mofuthu hore u re etele ka seqo.Re tšepa ho theha setsoalle sa nako e telele se thehiloeng tekano le melemo e kopanetsoeng.Haeba u batla ho ikopanya le rona, ka kopo u se ke oa tsilatsila ho letsetsa.Re tla ba khetho ea hau e ntle ka ho fetisisa.