3241 Semiconductor Epoxy Fiberglass Laminated Sheet
Tataiso ea Sehlahisoa
Sehlahisoa sena ke sehlahisoa sa laminated se entsoeng ka ho hatella ho chesang ka carbon black epoxy resin impregnation ea lesela la khalase ea motlakase e entsoeng ka alkali. E na le thepa ea semiconductor 'me e ka sebelisoa e le thepa e khahlanong le coroning pakeng tsa li-grooves tse kholo tsa motlakase, hape e ka sebelisoa e le likarolo tse sa sebetsaneng le tšepe tse sa sebetseng tlas'a maemo a phahameng.
Likaroloana:
1.Thepa ea semiconductor;
2.Anticorona thepa;
2.Good thepa thepa;
3.Ho hanyetsa mongobo;
4.Ho hanyetsa mocheso;
5.Ho hanyetsa mocheso: Kereiti ea B
Ho lumellana le litekanyetso
Ho ea ka GB/T 1303.4-2009 thermoset resin industry hard laminates - Karolo ea 4: epoxy resin hard laminates, IEC 60893-3-2-2011 thepa e sireletsang - thermoset resin industrial hard laminates - Karolo ea 3-2 ea litlhaloso tsa motho ka mong EPGC201.
Kopo
E ka sebelisoa e le thepa e thibelang li-coroning lipakeng tsa li-groove tse kholo, hape e ka sebelisoa e le lisebelisoa tse sa sebetseng tsa tšepe tlas'a maemo a phahameng.
Litšoantšo tsa lihlahisoa
Letsatsi le ka Sehloohong la Tekheniki
| NO. | ITEM | THUTO | INDEX BOHLOKO |
| 1 | Botenya | g/cm³ | 1.8-2.0 |
| 2 | Sekhahla sa ho monya metsi | % | <0.5 |
| 3 | Matla a ho kobeha a otlolohileng | MPa | ≥340 |
| 4 | Matla a kgatello a emeng | MPa | ≥330 |
| 5 | Matla a ts'usumetso e ts'oanang (mofuta oa charpy-gap) | KJ/m² | ≥30 |
| 6 | Matla a tšepe | MPa | ≥200 |
| 7 | Khanyetso ea Insulation | Ω | 1.0×103~1.0×106 |
LBH
Q1: Na u khoebo ea k'hamphani kapa moetsi?
Re baetsi ba ka sehloohong ba motsoako oa motlakase oa motlakase, re 'nile ra kopanela ho moetsi oa thermoset rigid composite ho tloha 2003.Boemo ba rona ke 6000TONS / selemo.
Q2: Mehlala
Mehlala ke mahala, o hloka feela ho lefella tefiso ea ho tsamaisa thepa.
Q3: U tiisa joang boleng ba tlhahiso ea bongata?
Bakeng sa ponahalo, boholo le botenya: re tla etsa tlhahlobo e felletseng pele re paka.
Bakeng sa boleng ba ts'ebetso: Re sebelisa foromo e tsitsitseng, 'me e tla ba tlhahlobo ea kamehla ea lisampole, re ka fana ka tlaleho ea tlhahlobo ea sehlahisoa pele re romelloa.
Q4: Nako ea ho fana
E itšetlehile ka palo ea taelo.Ka kakaretso, nako ea ho fana e tla ba matsatsi a 15-20.
Q5: Sephutheloana
Re tla sebelisa pampiri ea matsoho ho paka holim'a plywood pallet.haeba u na le litlhoko tse khethehileng tsa sephutheloana, re tla paka joalo ka tlhoko ea hau.
Q6: Tefo
TT, 30% T/T esale pele ,ho leka-lekana pele ho romelloa.Re boetse re amohela L/C.