3241 Semiconductor Epoxy Fiberglass Laminated Sheet
Tataiso ea Sehlahisoa
Sehlahisoa sena ke sehlahisoa sa laminated se entsoeng ka ho tobetsa ho chesang ka carbon black epoxy resin resin e entsoeng ka lesela la khalase le se nang alkali. E na le thepa ea semiconductor 'me e ka sebelisoa e le thepa e thibelang ho kokoana pakeng tsa li-motor grooves tse kholo, hape e ka sebelisoa. e le lisebelisoa tse sa sebetsaneng le lisebelisoa tsa tšepe tlas'a maemo a phahameng.
Likaroloana:
1.Thepa ea semiconductor;
2.Thepa ea Anticorona;
2.Good thepa thepa;
3.Ho hanyetsa mongobo;
4.Ho hanyetsa mocheso;
5.Ho hanyetsa mocheso: Kereiti ea B
Ho lumellana le litekanyetso
TS EN 60893-3-2-2009 IEC 60893-3-2-2009 lisebelisoa tsa insulating tsa motlakase oa thermoset resin - Karolo ea 4: Li-laminate tse thata tsa epoxy resin - Karolo ea 3-2 ea lisebelisoa tsa motho ka mong lintlha tse qaqileng EPGC201.
Kopo
E ka sebelisoa e le thepa e thibelang li-coroning lipakeng tsa li-groove tse kholo, hape e ka sebelisoa e le lisebelisoa tse sa sebetseng tsa tšepe tlas'a maemo a phahameng.
Litšoantšo tsa lihlahisoa
Letsatsi le ka Sehloohong la Tekheniki
| NO. | ITEM | THUTO | INDEX BOHLOKO |
| 1 | Botenya | g/cm³ | 1.8-2.0 |
| 2 | Sekhahla sa ho monya metsi | % | <0.5 |
| 3 | Matla a ho kobeha a otlolohileng | MPa | ≥340 |
| 4 | Matla a kgatello a emeng | MPa | ≥330 |
| 5 | Matla a ts'usumetso e ts'oanang (mofuta oa charpy-gap) | KJ/m² | ≥30 |
| 6 | Matla a tšepe | MPa | ≥200 |
| 7 | Khanyetso ea Insulation | Ω | 1.0×103~1.0×106 |
LBH
Q1: Na u khoebo ea k'hamphani kapa moetsi?
Re baetsi ba ka sehloohong ba motsoako oa motlakase oa motlakase, re 'nile ra kopanela ho moetsi oa thermoset rigid composite ho tloha 2003.Boemo ba rona ke 6000TONS / selemo.
Q2: Mehlala
Mehlala ke mahala, o hloka feela ho lefella tefiso ea ho tsamaisa thepa.
Q3: U tiisa joang boleng ba tlhahiso ea bongata?
Bakeng sa ponahalo, boholo le botenya: re tla etsa tlhahlobo e felletseng pele re paka.
Bakeng sa boleng ba ts'ebetso: Re sebelisa foromo e tsitsitseng, 'me e tla ba tlhahlobo ea kamehla ea lisampole, re ka fana ka tlaleho ea tlhahlobo ea sehlahisoa pele re romelloa.
Q4: Nako ea ho fana
E itšetlehile ka palo ea taelo.Ka kakaretso, nako ea ho fana e tla ba matsatsi a 15-20.
Q5: Sephutheloana
Re tla sebelisa pampiri e entsoeng ka matsoho ho paka holim'a plywood pallet.haeba u na le litlhoko tse khethehileng tsa sephutheloana, re tla paka joalo ka tlhoko ea hau.
Q6: Tefo
TT, 30% T/T esale pele ,ho leka-lekana pele ho romelloa.Re boetse re amohela L/C.