3240 Epoxy Phenolic Fiberglass Laminated Sheet
Tataiso ea Sehlahisoa
Sehlahisoa sena ke sehlahisoa sa laminated se entsoeng ka lesela la khalase le se nang motlakase la alkali le kenngoeng ka epoxy phenolic resin ka ho tobetsa ho chesang.Thermostablity ke grade B. E na le thepa e ntle ea mechine le ea dielectrical, E sebetsa ho mechine, motlakase, elektroniki, motlakase le masimo a mang. .E boetse e sebelisoa ha ho sebetsoa likarolo tsa insulating, 'me e sebetsoa ka mefuta eohle ea likarolo tsa insulating le lisebelisoa tse sireletsang likarolo tsa sebopeho, tse ka sebelisoang maemong a mongobo a tikoloho le oli ea transfoma.
Ho lumellana le litekanyetso
TS EN 60893-3-2-2009 IEC 60893-3-2-2009 lisebelisoa tsa insulating tsa motlakase oa thermoset resin - Karolo ea 4: Li-laminate tse thata tsa epoxy resin - Karolo ea 3-2 ea lisebelisoa tsa motho ka mong lintlha tse qaqileng EPGC201.
Kopo
1) E sebelisoa ho litlhoko tsa ts'ebetso ea mochini oa enjene e phahameng, lisebelisoa tsa motlakase le likarolo tsa sebopeho sa insulate
2) ICT, ITE e laola ts'ebetso ea likarolo tsa ho kenya letsoho, lisebelisoa tsa liteko, li-keypads tsa silicon
3) poleiti ea ho lokisa, plywood ea hlobo, li-countertops grinding plate, mechini ea ho paka, kama, joalo-joalo.
Litšoantšo tsa lihlahisoa
Letsatsi le ka Sehloohong la Tekheniki(Tobetsa mona ho khoasolla tlaleho ea tlhahlobo ea motho oa boraro)
| Thepa | Yuniti | Boleng bo tloaelehileng | Boleng bo tloaelehileng |
| Flexural matla perpendicular to laminations(MD) | MPa | ≥340 | 396 |
| Matla a matla a Charpy a tšoana le laminations(Notched,MD) | kJ/m2 | ≥33 | 40.6 |
| Matla a tsitsipano (MD) | MPa | _ | 263 |
| Matla a motlakase a ipapisitse le laminations (ho 90 ℃ ± 2 ℃ ho 25 # oli ea transformer, tlhahlobo ea mohato ka mohato, Φ25mm/Φ75mm cylindrical electrode) | kV/mm | ≥14.2 | 21.5 |
| Ho senyeha ha motlakase ho tsamaisana le laminations (ho 90 ℃ ± 2 ℃ ho 25 # oli ea transformer, tlhahlobo ea mohato ka mohato ea 20s, Φ130mm/Φ130mm poleiti ea motlakase) | kV | ≥35 | 90.0 |
| Tumello e Lekanyelitsoeng(1MHz) | _ | ≤5.5 | 4.62 |
| Insulation resistance (Taper pin electrode, le sebaka sa li-electrode ke 25.0mm) | Ω | ≥5.0 x1012 | 2.9x1013 |
| Insulation resistance(Kamora ho qoelisoa ka metsing lihora tse 24, u sebelisa li-electrode tsa "taper pin", 'me sebaka sa li-electrode ke 25.0mm | Ω | ≥5.0 x1010 | 2.3x1013 |
| Botenya | g/cm3 | 1.9-2.1 | 1.98 |
LBH
Q1: Na u khoebo ea k'hamphani kapa moetsi?
Re baetsi ba ka sehloohong ba motsoako oa motlakase oa motlakase, re 'nile ra kopanela ho moetsi oa thermoset rigid composite ho tloha 2003.Boemo ba rona ke 6000TONS / selemo.
Q2: Mehlala
Mehlala ke mahala, o hloka feela ho lefella tefiso ea ho tsamaisa thepa.
Q3: U tiisa joang boleng ba tlhahiso ea bongata?
Bakeng sa ponahalo, boholo le botenya: re tla etsa tlhahlobo e felletseng pele re paka.
Bakeng sa boleng ba ts'ebetso: Re sebelisa foromo e tsitsitseng, 'me e tla ba tlhahlobo ea kamehla ea lisampole, re ka fana ka tlaleho ea tlhahlobo ea sehlahisoa pele re romelloa.
Q4: Nako ea ho fana
E itšetlehile ka palo ea taelo.Ka kakaretso, nako ea ho fana e tla ba matsatsi a 15-20.
Q5: Sephutheloana
Re tla sebelisa pampiri e entsoeng ka matsoho ho paka holim'a plywood pallet.haeba u na le litlhoko tse khethehileng tsa sephutheloana, re tla paka joalo ka tlhoko ea hau.
Q6: Tefo
TT, 30% T/T esale pele ,ho leka-lekana pele ho romelloa.Re boetse re amohela L/C.